Method of fabricating circuit substrate

Details Method of fabricating circuit substrate Method of fabricating circuit substrate

2005-05-24

2005-05-24

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

Reexamination Certificate

active

06896173

ABSTRACT:
The present invention provides a method of fabricating a circuit substrate. First, a substrate having first pads and second pads is provided, wherein the first pads and second pads are arranged respectively on a first surface and a second surface of the substrate. The first pads are electrically connected to the second pads. Next, a conductive seed layer is formed on the second surface of the circuit substrate. Thereafter, a first conductive layer and a second conductive layer are electroplated respectively over the first pads and the second pads. Afterwards, the conductive seed layer is patterned.

REFERENCES:
patent: 4581301 (1986-04-01), Michaelson
patent: 4812213 (1989-03-01), Barton et al.
patent: 5209817 (1993-05-01), Ahmad et al.
patent: 5370766 (1994-12-01), Desaigoudar et al.
patent: 6458683 (2002-10-01), Lee
patent: 6586276 (2003-07-01), Towle et al.

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