Method of fabricating circuit configuration member

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C156S292000, C361S714000

Reexamination Certificate

active

07877868

ABSTRACT:
A circuit configuration member has a space capable of storing a resin in a liquid state is formed on the adhering face and on an inner side of the case main body. The adhering face of the heat radiating member and the circuit configuration member are adhered by an adhering member at inside of the space by integrally molding the case main body arranged to surround the circuit configuration member and the heat radiating member.

REFERENCES:
patent: 4754418 (1988-06-01), Hara
patent: 4876441 (1989-10-01), Hara et al.
patent: 5360942 (1994-11-01), Hoffman et al.
patent: 5526234 (1996-06-01), Vinciarelli et al.
patent: 5541448 (1996-07-01), Carpenter
patent: 5541452 (1996-07-01), Onoda et al.
patent: 5700981 (1997-12-01), Tuttle et al.
patent: 5786548 (1998-07-01), Fanucchi et al.
patent: 6201696 (2001-03-01), Shimizu et al.
patent: 6307749 (2001-10-01), Daanen et al.
patent: 6350953 (2002-02-01), Franzen
patent: 6374912 (2002-04-01), LaGrotta et al.
patent: 6459586 (2002-10-01), Miller et al.
patent: 6560115 (2003-05-01), Wakabayashi et al.
patent: 6775141 (2004-08-01), Yoshida et al.
patent: A-2003-164039 (2003-06-01), None

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