Method of fabricating ceramic package body for holding semicondu

Details Method of fabricating ceramic package body for holding semicondu Method of fabricating ceramic package body for holding semicondu

1995-06-07

1997-03-04

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205122, 205162, 437209, 437218, 257784, C25D 502, C25D 554, H01L 2118, H01L 2160

Patent

active

056075693

ABSTRACT:
A method of fabricating a ceramic package body for holding semiconductor devices which include external terminals arranged on an outer surface of the ceramic package body, a first conductive pattern having first conductors connected respectively to the external terminals, and a second conductive pattern having second conductors not connected to any said external terminal. The methodology includes a forming of the first and second conductive patterns on a green sheet so as to form the ceramic package body; a forming of a short-circuiting conductive pattern having one end connected to the external terminal and formed so as to be connected to the second conductive pattern to connect the second conductive pattern to the external terminal; a forming of the laminate body by laminating the green sheets; a firing of the laminate body; a plating of the external terminals, and the exposed portions of the first conductive pattern and the second conductive pattern by an electrolytic plating process with the external terminals connected to a plating electrode; and a removing of a portion of the short-circuiting pattern connected to the second conductive pattern by cutting so as to disconnect the second conductive pattern from the short-circuiting pattern to make the second conductors of the second conductive pattern become floating conductors.

REFERENCES:
patent: 3926746 (1975-12-01), Hargis

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