Method of fabricating ceramic circuit substrate

Details Method of fabricating ceramic circuit substrate Method of fabricating ceramic circuit substrate

1993-08-17

1995-10-10

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29846, 29848, H05K 100

Patent

active

054567785

ABSTRACT:
A ceramic circuit substrate is fabricated by preparing ceramic greensheets for the fabrication of the ceramic circuit substrate, and unsintered ceramic sheets unsinterable at a sintering temperature of said ceramic greensheets, forming via holes in said ceramic greensheets and filling the via holes with via hole conductor paste, printing conductive patterns on the ceramic greensheets, stacking and laminating the ceramic greensheets to prepare a laminated body, placing said unsintered ceramic sheets on the uppermost layer and-on the lowermost layer of the laminated body, bonding the sheets together by thermocompression to prepare a compressed body, firing the compressed body at the sintering temperature of ceramic greensheets, and removing the unsintered ceramic greensheets, wherein said via hole conductors are only in connection with the conductive patterns at the upper and/or lower ends of each via hole conductor.

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