Method of fabricating board having high density core layer...

Details Method of fabricating board having high density core layer... Method of fabricating board having high density core layer...

2011-01-25

2011-01-25

Levi, Dameon E (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S264000, C174S254000

Reexamination Certificate

active

07875809

ABSTRACT:
A circuit board includes a core layer substrate having a plated through hole filled with a dielectric material. The plated through hole has a sidewall coated with an inner electroless copper layer, and an electroplated metal layer plated on the inner electroless copper layer before the plated through hole is filled with the dielectric material. The outer portion of the filled plated through hole is thicker than the center portion and tapered toward the center portion to form a depressed surface on the filled plated through hole. The core layer substrate is covered with a patterned electroless copper layer and a patterned electroplated copper layer that connect with the inner electroless copper layer and electroplated metal layer of the plated through hole. The patterned electroplated copper layer forms a flat copper pad above the plated through hole.

REFERENCES:
patent: 6696305 (2004-02-01), Kung et al.
patent: 2004/0126547 (2004-07-01), Coomer
patent: 2007/0221404 (2007-09-01), Das et al.
patent: 2007/0235220 (2007-10-01), Shin et al.

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