Method of fabricating and using an image sensor package

Details Method of fabricating and using an image sensor package Method of fabricating and using an image sensor package

2005-09-20

2005-09-20

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S048000, C438S069000, C438S054000

Reexamination Certificate

active

06946316

ABSTRACT:
An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

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