Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-10-17
2006-10-17
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S125000, C029S874000
Reexamination Certificate
active
07122400
ABSTRACT:
The invention relates to an interconnection for chip sandwich structures by means of which chips can be electrically and mechanically connected to one another face-to-face, and to a method for the production thereof. The invention is intended to create interconnections that can be produced more cost-effectively and more effectively. This is achieved by virtue of the fact that pin- or sleeve-shaped contact elements (3) are arranged between the chips (1, 2), which contact elements create an electrical and mechanical interconnection between the contact pads (4, 5) of the semiconductor chips (1, 2) and are soldered to the latter.
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Chambliss Alonzo
Infineon - Technologies AG
Slater & Matsil L.L.P.
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