Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
1995-05-26
2002-01-08
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S830000, C029S840000, C029S843000, C228S180500, C228S199000
Reexamination Certificate
active
06336269
ABSTRACT:
ELECTRICAL CONTACT STRUCTURES FORMED BY CON-
FIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE
AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER
OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF
MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC
COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE
CONTACT STRUCTURES
OUTLINE
TOPIC HEADING
pg. #
TECHNICAL FIELD OF THE INVENTION
1
CROSS-REFERENCE TO RELATED APPLICATIONS
2
BACKGROUND OF THE INVENTION
4
DISCLOSURE (SUMMARY) OF THE INVENTION
23
BRIEF DESCRIPTION OF THE DRAWINGS
29
DETAILED DESCRIPTION OF THE INVENTION
47
Discussion of parent case 08/152,812
47
Discussion of parent case 08/340,144
53
BONDING A WIRE TO AN AREA ON A SUBSTRATE
57
FIGS. 1
, 1A-1F
PROPERTIES OF THE WIRE
61
FORMING AND SHAPING OF THE WIRE STEM
64
FIGS. 2
, 2A-2H
TYPES OF WIREBONDERS
82
ULTRASONIC FORMING
84
COMPENSATING FOR SPRINGBACK OF THE WIRE
87
FIGS. 3A and 3B
SEVERING THE WIRE
91
FIGS. 4A-4D
COATING THE WIRE STEM
98
FIGS. 5
, 5A-5I
COATING TECHNIQUES, MATERIALS AND THICKNESSES
109
CHARACTERISTICS OF THE CONTACT AREA
119
SELF-PLANARIZING FEATURES
123
FIGS. 6A-6C
ELECTRONIC COMPONENTS
129
SEMICONDUCTOR PACKAGES
130
FIGS. 7A-7D
SACRIFICIAL ELEMENTS
135
FIGS. 8A-8D
SACRIFICIAL MEMBERS AND PROBE EMBODIMENTS
137
FIGS. 9A-9C
ADDITIONAL PROBE EMBODIMENTS
141
FIGS. 10A-10K
CONTACT-FABRICATION ON A SACRIFICIAL SUBSTRATE
147
FIGS. 11A-11F
CONTACT GANG TRANSFER
150
FIGS. 12A-12F
TEMPORARY/PERMANENT METHODOLOGY
158
FIGS. 13A-13B
CHIP-LEVEL MOUNTING PROCESS
163
FIGS. 14A-14E
WAFER-LEVEL MOUNTING RESILIENT CONTACT
170
STRUCTURES
FIGS. 14F-14G
, 15, 15A
NO SHORTING LAYER REQUIRED
176
FIGS. 16A-16D
FIGS. 16E-16F
(stacking chips)
INTERPOSERS
181
FIGS. 17A-17E
ADDITIONAL INTERPOSER EMBODIMENTS
188
FIGS. 18A/B, 19A/B, 20A/B, 21, 22A/B, 22C, 22D-22F
ADDITIONAL SEMICONDUCTOR PACKAGE
204
EMBODIMENTS
FIGS. 23A
, 23B, 23C
“LOOP” EMBODIMENTS
209
FIGS. 24A
, 24B
THERMAL PATH EMBODIMENTS
214
FIGS. 24C/D, 24E
ASSEMBLIES OF ELECTRONIC COMPONENTS
217
FIGS. 25-30
ASSEMBLIES INCLUDING ELECTRONIC DEVICES
236
FIGS. 31
, 32
CARRIER ASSEMBLIES
240
FIGS. 33-35
, 36A/B/C, 37, 38-38A,
DUT TEST INTERFACE ARRANGEMENT
255
FIG. 39
VARIOUS ADDITIONAL EMBODIMENTS
257
NON-CONDUCTIVE STEM
257
FIGS. 40A
, 40B
STEM AFFIXED WITHOUT BONDING
259
FIGS. 41A-41C
MANUALLY SHAPING THE WIRE STEM
260
FIGS. 42
, 42A/B, 42C
OVERCOMING STICTION AND PRE-CLEANING THE
263
WIRE
FIGS. 43A
, 43B
ORIENTATION OF THE CONTACT STRUCTURES
264
FIG. 44
FLEXURE MECHANISMS
266
FIG. 45
REDUCING INDUCTANCE
267
FIGS. 46A-46F
, 46G
TAPERED WIRE STEM
270
FIG. 47
REMOVING THE WIRE STEM
271
FIGS. 48A-48E
EUTECTIC CONTACT TIP
272
FIGS. 49A-49C
TOPOGRAPHICAL CONTACT TIPS
274
FIGS. 50A
, 50B
DEMI-COATING
275
FIGS. 51A-51C
CONTACTING A CENTRAL PORTION OF THE WIRE
276
STEM
FIGS. 52A-52D
MULTIPLE FREE-STANDING WIRE STEMS,
278
SINGLE SEVERING STEP
FIGS. 52E-52F
, 53A-53D
FLAT TAB TIPS, AND METHODS OF MAKING
282
INTERCONNECTIONS
FIG. 54
ADVANTAGES
284
CLAIMS
290
ABSTRACT
356
TECHNICAL FIELD OF THE INVENTION
The invention relates to contact structures for making electrical connections to, from and between electronic components, especially microelectronic components and, more particularly, to contact structures exhibiting resiliency and/or compliance.
BACKGROUND OF THE INVENTION
Due to its superior conductive and non-corrosive characteristics, gold is a “material of choice” for making electrical connections between electronic components. For example, it is well known to make a plurality of wire bond connections between conductive pads on a semiconductor die and inner ends of leadframe fingers. This is cited as one example of making permanent connections between a first, “active” electronic component (the die) and a second “passive” electronic component (the leadframe).
The present invention advantageously employs wire-bonding equipment in which, generally, wire (e.g., gold wire) is supplied from a spool through a capillary (also referred to as a “bonding head”) and is bonded to a substrate. Generally, the nature of the bonding head will be determined by the nature of the bond to be made thereby. When the bonding head is for making a ball bond, it will generally be a “capillary”. When the bonding head is for making a wedge bond, it will generally be a “wedge”, these terms having recognized meanings in the art. To simplify matters, in the main hereinafter, the term “capillary” will be employed to indicate a bonding head suitable for making either ball or wedge bonds, applying thermal energy and/or compression during bonding.
The following U.S. patents (cited, when applicable, by patent number, first named inventor, month/year of issue, and US Class/Subclass), incorporated by reference herein, are indicative of the state of the art of wirebonding:
(a) U.S. Pat. No. 5,110,032 (Akiyama, et al.; May 1992; USCL 228/102), entitled METHOD AND APPARATUS FOR WIRE BONDING, discloses wire (
13
) supplied from a wire spool (
12
) through a capillary (
10
). (In this patent, the wire
13
is insulated.) A control unit (
20
) is shown which includes a CPU (processor) and a memory unit (storage for software commands). The control unit exercises control over movement of the capillary, and over a discharge power circuit (
18
) which, in conjunction with a discharging electrode (
17
) is used to sever the wire with a discharge voltage.
(b) U.S. Pat. No. 3,460,238 (Christy, et al.; August 1969; USCL 227/111), entitled WIRE SEVERING IN WIRE BONDING MACHINES, is directed to a technique whereby the wire severing operation in a wirebonder comprises moving the bonding needle (or “capillary”, as used herein) with holding pressure sufficient to frictionally engage the wire and insufficient to deform the wire away from the bond area. This patent is cited as exemplary of the fact that wire-bonding has been known for decades, and also of the fact that it is generally undesirable to “deform” the wire while moving the capillary.
(c) U.S. Pat. No. 5,095,187 (Gliga; March 1992; USCL 219/68), entitled WEAKENING WIRE SUPPLIED THROUGH A WIRE BONDER, discloses wire-bonding techniques wherein a wire is bonded to a contact on an electronic component by the application of one or a combination of heat, pressure and vibration. This patent discusses weakening or severing the wire by localized application of heat, and how the severing operation may result in a broadened portion on the severed end of the wire. The severing heat may be applied to the wire by means of an electrode from which an electric field can be made to extend to the wire such that an arc is created between the electrode and the wire. This patent describes a severing technique wherein a first portion of the arc is of a first polarity for weakening of the wire, and a second portion of the arc is of a reverse polarity for controlling dispersion of charged particles emitted from the wire.
(d) U.S. Pat. No. 4,860,433 (Miura; August 1989; USCL 29/605), entitled METHOD OF MANUFACTURING AN INDUCTANCE ELEMENT, discloses a technique of winding a coil of fine copper wire on a spool member on a substrate. The copper wire is insulated. It is known that the insulation will be removed from the end of the wire when an electronic flame off (EFO) spark severs the wire, such as at the conclusion of making a previous bond. An end portion of the wire is bonded to a conductive path on the substrate. Then, either the capillary or the substrate is rotated, and a table supporting the substrate may be moved in the vertical direction, to wind the coil of fine copper wire on the spool member. Finally, an opposite end portion of the wire is bonded to another conduc
Eldridge Benjamin N.
Grube Gary W.
Khandros Igor Y.
Mathieu Gaetan L.
Arbes Carl J.
Larwood David
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