Method of fabricating an integrated circuit that seals a...

Details Method of fabricating an integrated circuit that seals a... Method of fabricating an integrated circuit that seals a...

2006-04-18

2006-04-18

Picardat, Kevin M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Responsive to non-optical, non-electrical signal

C257S704000, C257S710000, C257S777000

Reexamination Certificate

active

07030432

ABSTRACT:
A method of fabricating an integrated circuit that includes a microelectromechanical (MEMS) device. The method includes forming a MEMS device on a substrate and forming an integrated circuit. The method further includes coupling the substrate to the integrated circuit to form a sealed cavity that includes the MEMS device. The substrate and the integrated circuit are coupled together in a controlled environment to establish a controlled environment within the cavity where the MEMS device is located.

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