Method of fabricating an integrated circuit package having a liq

Details Method of fabricating an integrated circuit package having a liq Method of fabricating an integrated circuit package having a liq

1995-06-06

1997-08-19

Picardat, Kevin

Metal working

Method of mechanical manufacture

Electrical device making

438117, 438118, 156 60, H01L 2160

Patent

active

056588313

ABSTRACT:
An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200.ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100.degree. C.-300.degree. C. for 0.5 hours-3.0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.

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patent: 5338579 (1994-08-01), Ogawa et al.

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