Method of fabricating an integrated circuit having active region

Details Method of fabricating an integrated circuit having active region Method of fabricating an integrated circuit having active region

1991-03-25

1993-03-23

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437225, 437227, 148DIG28, 148DIG168, 357 55, H01L 2100, H01L 2102, H01L 2178

Patent

active

051963787

ABSTRACT:
The invention relates to a method of scribing and separating dice from each other after fabrication in a semiconductor wafer in a manner such that active circuit regions in the dice reside as near to an edge of a die as possible. The wafer is anistropically etched through the active layer and into the substrate through an opening in the mask to form a generally V-shaped channel with the dice then being separated along a vertex of the channel. The dice are then positioned to abut each other in the form of a mosaic.

REFERENCES:
patent: 3432919 (1969-03-01), Rosvold
patent: 3608186 (1971-09-01), Hutson
patent: 4236296 (1980-12-01), Woolhouse et al.
patent: 4542397 (1985-09-01), Biegelsen et al.
patent: 4698131 (1987-10-01), Araghi et al.
Hibberd, Integrated Circuits, McGraw-Hill, 1969, pp. 38-43.
Hamilton and Howard, Basic Integrated Circuit Engineering, (McGraw-Hill, N.Y., 1975), pp. 4-9.

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