Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2008-03-18
2010-11-02
Pham, Hoai V (Department: 2892)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S103000, C257SE21583
Reexamination Certificate
active
07824951
ABSTRACT:
The present invention includes a memory cell device and method that includes a memory cell, a first electrode, a second electrode, phase-change material and an isolation material. The phase-change material is coupled adjacent the first electrode. The second electrode is coupled adjacent the phase-change material. The isolation material adjacent the phase-change material thermally isolates the phase-change material.
REFERENCES:
patent: 5751012 (1998-05-01), Wolstenholme et al.
patent: 5837564 (1998-11-01), Sandhu et al.
patent: 6339544 (2002-01-01), Chiang et al.
patent: 6507061 (2003-01-01), Hudgens et al.
patent: 6625054 (2003-09-01), Lowrey et al.
patent: 6673648 (2004-01-01), Lowrey
patent: 6791102 (2004-09-01), Johnson et al.
patent: 6791107 (2004-09-01), Gill et al.
patent: 6937507 (2005-08-01), Chen
patent: 7018918 (2006-03-01), Kloster et al.
patent: 2002/0017701 (2002-02-01), Klersy et al.
patent: 2002/0168852 (2002-11-01), Harshfield et al.
patent: 2003/0003647 (2003-01-01), Dennison et al.
patent: 2003/0156468 (2003-08-01), Campbell et al.
patent: 2003/0194865 (2003-10-01), Gilton
patent: 2004/0051094 (2004-03-01), Ooishi
patent: 2004/0251551 (2004-12-01), Hideki
patent: 2006/0092693 (2006-05-01), Chen
patent: 2006/0163554 (2006-07-01), Lankhorst et al.
patent: 10236439 (2004-02-01), None
patent: 10231646 (2007-01-01), None
patent: 1318552 (2003-06-01), None
Ha, Y. H. et al., “An Edge Contact Type Cell for Phase Change RAM Featuring Very Low Power Consumption,” Symposium on VLSI Technology Digest of Technical Papers, pp. 2, (2003).
Horii, H. et al., “A Novel Cell Technology Using N-Doped GeSbTe Films for Phase Change RAM,” Symposium on VLSI Technology Digest of Technical Papers, pp. 2, (2003).
Hwang, Y.N. et al., “Full Integration and Reliability Evaluation of Phase-Change RAM Based on 0.24μm-CMOS Technologies,” pp. 2, (2003).
Lai, Stefan et al., “OUM-A 180 nm Nonvolatile Memory Cell Element Technology for Stand Alone and Embedded Applications,” IEDM Technical Digest, Session 36.5, pp. 4, (2001).
Pellizzer, F. et al., “Novel μTrench Phase-Change Memory Cell for Embedded and Stand-Alone Non-Volatile Memory Applications,” VLSI Technology Digest of Technical Papers, pp. 2, (2004).
A translation of the Notification of Reasons for Refusal for Application No. 10 2007 7020518 mailed Jun. 24, 2008 (3 pgs.).
Happ Thomas
Zaidi Shoaib
Dicke Billig & Czaja, PLLC
Pham Hoai V
Qimonda AG
LandOfFree
Method of fabricating an integrated circuit having a memory... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating an integrated circuit having a memory..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating an integrated circuit having a memory... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4227519