Method of fabricating an inkjet head

Details Method of fabricating an inkjet head Method of fabricating an inkjet head

2006-11-07

2006-11-07

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S890100, C029S846000, C029SDIG016, C029SDIG019, C216S027000, C216S052000, C451S028000, C451S041000, C347S047000, C347S070000, C347S071000

Reexamination Certificate

active

07131173

ABSTRACT:
First, a first electrode layer4, a piezoelectric layer5, a second electrode layer6and an oscillation layer7are stacked in this order over one surface of a silicon substrate1. Next, an ink chamber partition8and a nozzle plate11are stacked over the oscillation layer7. Subsequently, the silicon substrate1is ground away to a predetermined thickness from a surface thereof opposite to the first electrode layer4, and then a remnant silicon substrate13is dry etched away. Thereafter, the first electrode layer4is patterned to form a plurality of inkjet mechanisms2, 2, . . . . Finally, the plurality of inkjet mechanisms2, 2, . . . are divided to simultaneously fabricate a plurality of inkjet heads3, 3, . . . .

REFERENCES:
patent: 6988316 (2006-01-01), Kweon et al.
patent: 2002/0180840 (2002-12-01), Matsumoto et al.
patent: 2-263653 (1990-10-01), None
patent: 10286960 (1998-10-01), None
patent: 2001-130011 (2001-05-01), None
Hock et al., “Designing a Fluid Pump for Microfluidic Cooling Systems in Electronic Components”, Electronic Packaging Technology Conference, IEEE Proceedings 1997, Oct. 8-10, 1997, pp. 115-118.
International Search Report for PCT/JP03/15643, mailed Mar. 23, 2004; ISA/JPO.

Affiliated with

Also associated with

Rating

Method of fabricating an inkjet head does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating an inkjet head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating an inkjet head will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3705226