Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2006-06-27
2006-06-27
Norton, Nadine G. (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C347S065000, C438S021000
Reexamination Certificate
active
07067067
ABSTRACT:
A method of fabricating an inkjet printhead chip for an inkjet printhead includes the step of depositing a first layer of a sacrificial material on a wafer substrate that incorporates drive circuitry. A deposition zone for a passive beam and a passive structure is formed with the first layer of sacrificial material. A metal layer is deposited on the first layer of sacrificial material. The metal layer is etched to define the passive beam and the passive structure. A second layer of a sacrificial material is deposited on the metal layer. A deposition zone for an active beam is formed on the second layer of sacrificial material. A metal layer is deposited on the second layer of sacrificial material. The metal layer is etched to define the active beam. The deposition zone is formed so that the metal layer makes electrical contact with the drive circuitry. A third layer of sacrificial material is deposited on the metal layer. A deposition zone for a dynamic structure is formed on the third layer of sacrificial material. A structural layer is deposited on the third layer of sacrificial material. The structural layer is etched to define the dynamic structure. The sacrificial material is etched away.
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No affiliations
Chen Eric B.
Norton Nadine G.
Silverbrook Research Pty Ltd
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