Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2006-04-04
2006-04-04
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Forming or treating thermal ink jet article
Reexamination Certificate
active
07022250
ABSTRACT:
A method of fabricating an inkjet printhead chip includes the step of forming a layer of sacrificial material on a substrate, such that the layer is between three and ten microns thick. A first layer of thermal expansion material is formed on the sacrificial material. A heater circuit is formed on the first layer of thermal expansion material. The sacrificial material and the first layer of thermal expansion material are formed to permit the electrical circuit to make electrical contact with the drive circuitry. A second layer of the thermal expansion material is formed on the heater circuit. A suitable process is applied on the second layer of thermal expansion material to render a surface of the second layer hydrophilic. The sacrificial material is removed.
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Culbert Roberts
Hassanzadeh Parviz
Silverbrook Research Pty Ltd
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