Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2008-01-21
2011-10-04
Ahmed, Shamim (Department: 1713)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S002000, C216S041000, C216S067000, C216S083000, C216S096000, C029S890100, C347S054000, C347S065000
Reexamination Certificate
active
08029686
ABSTRACT:
The invention relates to a method of fabricating an ink jet nozzle. The method includes the steps of depositing and etching a passivation layer on a silicon substrate having drive circuitry and an interlayer dielectric interconnect to form a first sacrificial scaffold. Also included are the steps of depositing heater material over the first sacrificial scaffold and etching said heater material to define a heater element, and depositing and developing a layer of photoresist to define a second sacrificial scaffold defining sidewalls for a nozzle chamber. The method also includes the steps of depositing silicon nitride onto the second sacrificial scaffold to form a roof over the nozzle chamber, and etching a nozzle aperture through the roof down to the second sacrificial scaffold.
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McAvoy Gregory John
Silverbrook Kia
Ahmed Shamim
Silverbrook Research Pty Ltd
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