Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2006-02-14
2006-02-14
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S083000, C347S065000
Reexamination Certificate
active
06998062
ABSTRACT:
A method of fabricating an ink jet nozzle arrangement including the steps of providing a silicon wafer. A plurality of permanent layers are deposited on one side of the wafer. A nozzle region or chamber is etched in the permanent layers to the silicon wafer level. An actuator and ink ejection port are etched on at least one permanent layer so that the ink ejection port is in communication with the nozzle chamber for effecting ink ejection.
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Ahmed Shamim
Silverbrook Research PTY LTD
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