Method of fabricating an epitaxial silicon-germanium layer...

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

Reexamination Certificate

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C117S089000, C117S101000, C117S102000, C117S105000, C117S935000, C117S936000

Reexamination Certificate

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10934188

ABSTRACT:
A method of fabricating an epitaxial silicon-germanium layer for an integrated semiconductor device comprises the step of depositing an arsenic in-situ doped silicon-germanium layer, wherein arsenic and germanium are introduced subsequently into different regions of said silicon-germanium layer during deposition of said silicon-germanium layer. By separating arsenic from germanium any interaction between arsenic and germanium is avoided during deposition thereby allowing fabricating silicon-germanium layers with reproducible doping profiles.

REFERENCES:
patent: 6346452 (2002-02-01), Kabir et al.
patent: 6492711 (2002-12-01), Takagi et al.
patent: 6559022 (2003-05-01), U'Ren
patent: 6787793 (2004-09-01), Yoshida
patent: 6838359 (2005-01-01), De Boer
patent: 6958253 (2005-10-01), Todd
patent: WO 03/046947 (2002-12-01), None
E. Suvar et al., “Influence of doping on thermal stability of Si/Sl1-xGex/Sl heterostructures,” Material Science and Engineering B102 (2003) 53-57.

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