Method of fabricating an encapsulated semiconductor device...

Details Method of fabricating an encapsulated semiconductor device... Method of fabricating an encapsulated semiconductor device...

2005-09-06

2005-09-06

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000, C438S127000, C029S857000, C029S858000, C029S868000, C361S772000, C361S773000

Reexamination Certificate

active

06939740

ABSTRACT:
A resin-sealed semiconductor IC package of a large integration size having a size substantially equal to that of its component semiconductor IC chip. The resin-sealed semiconductor IC package includes a semiconductor IC chip, a plurality of leads arranged on the semiconductor IC chip and having end portions bent so as to extend perpendicularly to the major surface of the semiconductor IC chip, a resin molding sealing the semiconductor IC chip and the leads therein so that the tips of the end portions of the leads are exposed on one surface thereof, and conductive elements connected respectively to the exposed tips of the leads.

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