Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-10-10
2006-10-10
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C228S180220, C257S738000, C257S779000
Reexamination Certificate
active
07118940
ABSTRACT:
An electronic package having a controlled standoff height between a surface mount device and a circuit board. The electronic package includes a circuit board having a substrate and circuitry including mounting pads and a surface mount device having circuitry and contact terminals. Solder joints connect the contact terminals of the surface mount device to the mounting pads on the circuit board. A dielectric underfill is disposed between the circuit board and the surface mount device, and a plurality of standoff members are disposed in the underfill material to provide a separation distance between the circuit board and the surface mount device.
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Ihms David W.
Myers Bruce A.
Oman Todd P.
Chambliss Alonzo
Delphi Technologies Inc.
Funke Jimmy L.
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