Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-01-31
2006-01-31
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Plural joints
C361S767000, C228S193000
Reexamination Certificate
active
06991151
ABSTRACT:
To reduce the capacitance of an electronic module having an active component (1) bonded to a base (2), thereby enabling its cutoff frequency to be raised, the method provides a plurality of contact pads (P1, P′1, P2, P3, P′3) and a plurality of contact zones (Z1, Z′1, Z2, Z3, Z′3) on the component and on the base respectively. First structures (P1, P′1, Z1, Z′1) are adapted to be bonded together by melting solder. Second structures (P2, Z2) of small surface area are designed to be bonded together by thermal compression delivered by the mutual force of attraction that results between the component and the base due to the solder melting. The invention is particularly applicable to making optoelectronic components used in high data rate optical transmission systems.
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DeMiguel S et al: “Low-cost, polarization independent, tapered photodiodes with bandwidth over 50 GHz” Electronic Letters, IEE Stevenage, GB, vol. 37, No. 8, Apr. 12, 2001 pp. 516-518, XP 006016458.
Alcatel
Johnson Jonathan
Sughrue & Mion, PLLC
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