Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-02-13
2007-02-13
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S117000, C438S121000, C029S825000, C029S874000
Reexamination Certificate
active
11222737
ABSTRACT:
An electronic component includes at least one semiconductor chip, which has an active chip top side with contact areas and has a chip rear side arranged on a carrier top side of a circuit carrier. The circuit carrier and the chip top side are covered by a common rewiring layer having external contact areas at a different level. The different level is matched to a common level of external contact top sides by means of different heights of in part compliant external contacts.
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Chambliss Alonzo
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
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