Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-03-29
2005-03-29
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S113000
Reexamination Certificate
active
06872594
ABSTRACT:
The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic components of overlying and underlying semiconductor chips are thus connected to one another via the through contacts.
REFERENCES:
patent: 3921916 (1975-11-01), Bassous
patent: 4930216 (1990-06-01), Nelson
patent: 5055696 (1991-10-01), Haraichi et al.
patent: 5107586 (1992-04-01), Eichelberger et al.
patent: 5126286 (1992-06-01), Chance
patent: 5270493 (1993-12-01), Inoue et al.
patent: 5478781 (1995-12-01), Bertin et al.
patent: 5481133 (1996-01-01), Hsu
patent: 5517057 (1996-05-01), Beilstein, Jr. et al.
patent: 5656553 (1997-08-01), Leas et al.
patent: 5673478 (1997-10-01), Beene et al.
patent: 5688721 (1997-11-01), Johnson
patent: 5857858 (1999-01-01), Gorowitz et al.
patent: 5880011 (1999-03-01), Zablotny et al.
patent: 6034438 (2000-03-01), Petersen
patent: 6080655 (2000-06-01), Givens et al.
patent: 07006982 (1995-01-01), None
patent: 2000-252411 (2000-09-01), None
Gebauer Uta
Wennemuth Ingo
Greenberg Laurence A.
Locher Ralph E.
Malsawma Lex H.
Smith Matthew
Stemer Warner H.
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