Method of fabricating an adsorbent packet with integral heat shi

Package making – Methods – Forming or partial forming a receptacle and subsequent filling

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

53410, B65B 4700

Patent

active

051196166

ABSTRACT:
An adsorbent packet including a casing of permeable material, adsorbent in the casing, and a sleeve of metal foil fused to a central portion of the casing by ultrasonic welding and having a layer of nylon on the outside thereof. A method of fabricating an adsorbent packet including the steps of superimposing a first sheet of permeable material over a first sheet of metal foil, superimposing a second sheet of metal foil over a second sheet of permeable material, forming the first sheets into a pocket with the metal foil on the outer surface of the central portion thereof, filling the pocket with adsorbent, superimposing the second sheet of permeable material and the second sheet of metal foil over the pocket with the second sheet of metal foil on the outside thereof and in line with the first sheet of metal foil, sealing edge portions of all of the first and second sheets to form a casing containing adsorbent with a metal foil sleeve on the outside thereof and with a seam extending copmletely around the casing, and trimming the flash off of the material outside of the seam.

REFERENCES:
patent: 3526186 (1970-09-01), Cornelius
patent: 3815315 (1974-06-01), Glick
patent: 3930041 (1975-12-01), Komatsu et al.
patent: 3977153 (1976-08-01), Schrenk
patent: 4145001 (1979-03-01), Weyenberg et al.
patent: 4223512 (1980-09-01), Buchner
patent: 4372098 (1983-02-01), Mason
patent: 4495749 (1985-01-01), Faller
patent: 4614076 (1986-09-01), Rathemacher
patent: 4683702 (1987-08-01), Vis
patent: 4687336 (1989-09-01), Stewart

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating an adsorbent packet with integral heat shi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating an adsorbent packet with integral heat shi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating an adsorbent packet with integral heat shi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1796125

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.