Method of fabricating airbridge metal interconnects

Details Method of fabricating airbridge metal interconnects Method of fabricating airbridge metal interconnects

1989-03-14

1989-08-15

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437192, 437230, 437927, H01L 21283

Patent

active

048574813

ABSTRACT:
An improved method of fabricating airbridge metal interconnects uses two photoresist layers having different solubility characteristics. This allows for the removal of one resist without affecting the other. Thus, the underlying semiconductor structure is protected from subsequent etches of the ground plane metal. Consequently, a greater process latitude allows for obtaining higher device yields in fabricating high frequency semiconductor devices employing airbridge metal interconnects.

REFERENCES:
patent: 3890177 (1975-06-01), Pfahnl et al.
patent: 4289846 (1981-09-01), Parks et al.
patent: 4665610 (1987-05-01), Barth

Affiliated with

Also associated with

Rating

Method of fabricating airbridge metal interconnects does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating airbridge metal interconnects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating airbridge metal interconnects will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-121425