Method of fabricating a transparent metal oxide electrode struct

Details Method of fabricating a transparent metal oxide electrode struct Method of fabricating a transparent metal oxide electrode struct

1980-12-22

1982-06-22

McCamish, Marion

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

156662, 156664, 156667, 156651, 156656, 156657, 357 65, 357 68, 357 71, 428209, 428901, C23F 102, H01L 21306

Patent

active

043362958

ABSTRACT:
A method of fabricating an electrode structure of transparent metal oxide on a solid-state electrooptical device is disclosed. A layer of conductive transparent metal oxide is deposited on the surface of the device. Thereafter, the transparent conductive layer is covered with a layer of pattern metal that forms a good electrical contact with the transparent metal oxide and is etchable independently of the transparent metal oxide. Portions of the pattern metal are etched away to define the desired electrode pattern using a photolithographic technique and an etchant that attacks the pattern metal but does not substantially attack the transparent metal oxide layer. Portions of the transparent metal oxide layer not covered by the pattern metal are removed using an etchant that attacks the transparent metal oxide but does not substantially attack the pattern metal. Portions of the remaining pattern metal are removed from imaging areas of the device, leaving pattern metal in the peripheral areas where electrical connections to the electrodes are to be located, using photolithographic techniques and the etchant that attacks the pattern metal but not the transparent metal oxide.
In the preferred embodiment, the pattern metal comprises chromium, and to complete the circiut and form bonding pads, a final metallization layer (e.g. gold) is deposited over the structure, and the structure is baked to adhere the final metal to the remaining portions of the chromium. Finally, portions of the final layer of metal are removed leaving the conductor pattern and the bonding pads.

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