Method of fabricating a substrate for a semiconductor chip packa

Details Method of fabricating a substrate for a semiconductor chip packa Method of fabricating a substrate for a semiconductor chip packa

1986-05-23

1988-04-12

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29825, 156172, 357 81, H01R 432

Patent

active

047372176

ABSTRACT:
A substrate for a semiconductor chip package comprises a metal layer characterized by a high coefficient of thermal conductivity and girded by a restraining wrapper characterized by both a low coefficient of thermal expansion and a high ultimate tensile strength.

REFERENCES:
patent: 4196442 (1980-04-01), Kuniya et al.
patent: 4254548 (1981-03-01), Arakawa et al.

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