Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2006-11-28
2006-11-28
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
C029S830000
Reexamination Certificate
active
07140531
ABSTRACT:
A method of fabricating a substantially zero signal degradation electrical connection on a printed circuit board includes providing a printed circuit board defined by a dielectric structure core. The dielectric structure core has a first surface, which includes a first connecting pad having an edge and a second connecting pad having an edge separated from an adjacent to the edge of the first conducting pad. The edges of the first and second conducting pads define therebetween a surface area of the first surface. A solder paste is applied on the first and second conducting pads and on the first surface of the dielectric structure core. The solder paste at least partially covers the surface area of the first surface between the edges of the first and second conducting pads, thereby forming a substantially zero signal degradation electrical connection between the first and second conducting pads.
REFERENCES:
patent: 4311267 (1982-01-01), Lim
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 5011066 (1991-04-01), Thompson
patent: 5260518 (1993-11-01), Tanaka et al.
patent: 5325629 (1994-07-01), Hsu
patent: 5395643 (1995-03-01), Brown et al.
patent: 5404637 (1995-04-01), Kawakami
patent: 5436028 (1995-07-01), Becher et al.
patent: 5463191 (1995-10-01), Bell et al.
patent: 5509597 (1996-04-01), Laferriere
patent: 5543584 (1996-08-01), Handford et al.
patent: 5553538 (1996-09-01), Freitag
patent: 5740730 (1998-04-01), Thompson, Sr.
patent: 5743007 (1998-04-01), Onishi et al.
patent: 5804248 (1998-09-01), Hewett
patent: 5867898 (1999-02-01), Lauffer et al.
patent: 6020561 (2000-02-01), Ishida et al.
patent: 6026566 (2000-02-01), Urban et al.
patent: 6091155 (2000-07-01), Jonaidi
patent: 6165596 (2000-12-01), Chen et al.
patent: 6259608 (2001-07-01), Berardinelli et al.
patent: 6320139 (2001-11-01), Byle et al.
patent: 6664482 (2003-12-01), Shaeffer et al.
Basham Everett
Price Christopher D.
Shaeffer Ian P.
Hewlett--Packard Development Company, L.P.
Johnson Jonathan
LandOfFree
Method of fabricating a substantially zero signal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating a substantially zero signal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a substantially zero signal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3688257