Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-05-13
2008-05-13
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C438S125000, C257S724000, C257S777000, C257S783000
Reexamination Certificate
active
10389433
ABSTRACT:
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
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IBM Research Disclosure RD41388 (N.N), Sep. 1, 1998.
Chew Beng Chye
Lim Thiam Chye
Neo Chee Peng
Pour Cheng Poh
Tan Hock Chuan
Chambliss Alonzo
Micro)n Technology, Inc.
Whyte Hirschboeck Dudek SC
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