Method of fabricating a stacked die having a recess in a die...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

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Details

C438S118000, C438S125000, C257S724000, C257S777000, C257S783000

Reexamination Certificate

active

10389433

ABSTRACT:
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.

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IBM Research Disclosure RD41388 (N.N), Sep. 1, 1998.

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