Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-05-13
2008-05-13
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C438S125000, C257S724000, C257S777000, C257S783000
Reexamination Certificate
active
07371608
ABSTRACT:
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
REFERENCES:
patent: 4571611 (1986-02-01), Kashiwagi
patent: 5019943 (1991-05-01), Fassbender et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5760478 (1998-06-01), Bozso et al.
patent: 5804004 (1998-09-01), Brathwaite et al.
patent: 5886412 (1999-03-01), Fogal et al.
patent: 5904497 (1999-05-01), Akram
patent: 5910686 (1999-06-01), Hamzehdoost et al.
patent: 5952725 (1999-09-01), Ball
patent: 5985695 (1999-11-01), Freyman et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6052287 (2000-04-01), Palmer et al.
patent: 6080264 (2000-06-01), Ball
patent: 6081997 (2000-07-01), Chia et al.
patent: 6084308 (2000-07-01), Jackson et al.
patent: 6165815 (2000-12-01), Ball
patent: 6207474 (2001-03-01), King et al.
patent: 6222265 (2001-04-01), Akram et al.
patent: 6239484 (2001-05-01), Dore et al.
patent: 6262488 (2001-07-01), Masayuki et al.
patent: 6271056 (2001-08-01), Farnworth et al.
patent: 6294839 (2001-09-01), Mess et al.
patent: 6340842 (2002-01-01), Nakamura
patent: 6351028 (2002-02-01), Akram
patent: 6380615 (2002-04-01), Park et al.
patent: 6380631 (2002-04-01), Mess et al.
patent: 6407456 (2002-06-01), Ball
patent: 6472758 (2002-10-01), Glenn et al.
patent: 6476475 (2002-11-01), Lee
patent: 6483187 (2002-11-01), Chao et al.
patent: 6512302 (2003-01-01), Mess et al.
patent: 6525413 (2003-02-01), Cloud et al.
patent: 6531784 (2003-03-01), Shim et al.
patent: 6558966 (2003-05-01), Mess et al.
patent: 6563205 (2003-05-01), Fogal et al.
patent: 6706557 (2004-03-01), Koopmans
patent: 6730543 (2004-05-01), Akram
patent: 6731009 (2004-05-01), Jones et al.
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6777797 (2004-08-01), Egawa
patent: 6784023 (2004-08-01), Ball
patent: 6818998 (2004-11-01), Kwon et al.
patent: 6833287 (2004-12-01), Hur et al.
patent: 6861760 (2005-03-01), Oka et al.
patent: 6906408 (2005-06-01), Cloud et al.
patent: 6919631 (2005-07-01), Hoffman et al.
patent: 6939746 (2005-09-01), Bolken
patent: 6984544 (2006-01-01), Cloud et al.
patent: 2002/0096754 (2002-07-01), Chen et al.
patent: 2003/0111720 (2003-06-01), Tan et al.
patent: 10209204 (2003-10-01), None
patent: 1093165 (2001-04-01), None
patent: 62185348 (1987-08-01), None
patent: 02109410 (1990-04-01), None
patent: 06244360 (1994-09-01), None
patent: 11289023 (1999-10-01), None
patent: 2000049279 (2000-02-01), None
patent: 2000058742 (2000-02-01), None
patent: 2003282818 (2003-10-01), None
IBM Research Disclosure RD41388 (N.N), Sep. 1, 1998.
Chew Beng Chye
Lim Thiam Chye
Neo Chee Peng
Pour Cheng Poh
Tan Hock Chuan
Chambliss Alonzo
Micro)n Technology, Inc.
Whyte Hirschboeck Dudek SC
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