Method of fabricating a solder pad structure

Details Method of fabricating a solder pad structure Method of fabricating a solder pad structure

2009-10-16

2011-11-08

Arbes, Carl (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S840000, C029S843000

Reexamination Certificate

active

08051560

ABSTRACT:
A method for fabricating a solder pad structure. A circuit board having thereon at least one copper pad is provided. A solder resist is formed on the circuit board and covers the copper pad. A solder resist opening, which exposes a portion of the copper pad, is formed in the solder resist by laser. The laser also creates a laser activated layer on sidewalls of the solder resist opening. A chemical copper layer is then grown from the exposed copper pad and concurrently from the laser activated layer.

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patent: 5670262 (1997-09-01), Dalman
patent: 7438969 (2008-10-01), Kojima et al.
patent: 2007/0085126 (2007-04-01), Hsu
patent: 2007/0247822 (2007-10-01), Naundorf
patent: 1288591 (2007-10-01), None

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