Method of fabricating a silicon carbide vertical MOSFET and devi

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257328, 257343, H01L 29161, H01L 2920, H01L 2922, H01L 2910

Patent

active

054517974

ABSTRACT:
A silicon carbide vertical MOSFET formed on a silicon carbide substrate with portions of epitaxial layers defining the various transistor electrodes, rather than defining the electrodes with implants and diffusion. An opening is formed in some of the epitaxial layers and a conductive layer is formed therein to electrically connect a drain contact on the rear of the substrate to the components on the front of the substrate.

REFERENCES:
patent: 4859621 (1989-08-01), Einthoven
patent: 5103285 (1992-04-01), Furumura et al.
patent: 5264713 (1993-11-01), Palmour

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating a silicon carbide vertical MOSFET and devi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a silicon carbide vertical MOSFET and devi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a silicon carbide vertical MOSFET and devi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1829892

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.