Method of fabricating a semiconductor structure that...

Details Method of fabricating a semiconductor structure that... Method of fabricating a semiconductor structure that...

2008-03-25

2008-03-25

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C257SE21122

Reexamination Certificate

active

11028248

ABSTRACT:
A method of fabricating a semiconductor structure. According to one aspect of the invention, on a first semiconductor substrate, a first compositionally graded Si1-xGexbuffer is deposited where the Ge composition x is increasing from about zero to a value less than about 20%. Then a first etch-stop Si1-yGeylayer is deposited where the Ge composition y is larger than about 20% so that the layer is an effective etch-stop. A second etch-stop layer of strained Si is then grown. The deposited layer is bonded to a second substrate. After that the first substrate is removed to release said first etch-stop S1-yGeylayer. The remaining structure is then removed in another step to release the second etch-stop layer. According to another aspect of the invention, a semiconductor structure is provided. The structure has a layer in which semiconductor devices are to be formed. The semiconductor structure includes a substrate, an insulating layer, a relaxed SiGe layer where the Ge composition is larger than approximately 15%, and a device layer selected from a group consisting of, but not limited to, strained-Si, relaxed Si1-yGeylayer, strained Si1-zGezlayer, Ge, GaAs, III-V materials, and II-VI materials, where Ge compositions y and z are values between 0 and 1.

REFERENCES:
patent: 4010045 (1977-03-01), Ruehrwein
patent: 4370510 (1983-01-01), Stirn
patent: 4704302 (1987-11-01), Bruel et al.
patent: 4710788 (1987-12-01), Dambkes et al.
patent: 4969031 (1990-11-01), Kobayashi et al.
patent: 4987462 (1991-01-01), Kim et al.
patent: 4990979 (1991-02-01), Otto
patent: 4997776 (1991-03-01), Harame et al.
patent: 5089872 (1992-02-01), Ozturk et al.
patent: 5091767 (1992-02-01), Bean et al.
patent: 5155571 (1992-10-01), Wang et al.
patent: 5166084 (1992-11-01), Pfiester
patent: 5177583 (1993-01-01), Endo et al.
patent: 5202284 (1993-04-01), Kamins et al.
patent: 5207864 (1993-05-01), Bhat et al.
patent: 5208182 (1993-05-01), Narayan et al.
patent: 5212110 (1993-05-01), Pfiester et al.
patent: 5240876 (1993-08-01), Gaul et al.
patent: 5241197 (1993-08-01), Murakami et al.
patent: 5242847 (1993-09-01), Ozturk et al.
patent: 5250445 (1993-10-01), Bean et al.
patent: 5285086 (1994-02-01), Fitzgerald
patent: 5291439 (1994-03-01), Kauffmann et al.
patent: 5298452 (1994-03-01), Meyerson
patent: 5310451 (1994-05-01), Tejwani et al.
patent: 5316958 (1994-05-01), Meyerson
patent: 5346848 (1994-09-01), Grupen-Shemansky et al.
patent: 5374564 (1994-12-01), Bruel
patent: 5399522 (1995-03-01), Ohori
patent: 5405802 (1995-04-01), Yamagata et al.
patent: 5413679 (1995-05-01), Godbey
patent: 5424243 (1995-06-01), Takasaki
patent: 5426069 (1995-06-01), Selvakumar et al.
patent: 5426316 (1995-06-01), Mohammad
patent: 5439843 (1995-08-01), Sakaguchi et al.
patent: 5442205 (1995-08-01), Brasen et al.
patent: 5461250 (1995-10-01), Burghartz et al.
patent: 5479033 (1995-12-01), Baca et al.
patent: 5484664 (1996-01-01), Kitahara et al.
patent: 5523243 (1996-06-01), Mohammad
patent: 5523592 (1996-06-01), Nakagawa et al.
patent: 5534713 (1996-07-01), Ismail et al.
patent: 5536361 (1996-07-01), Kondo et al.
patent: 5548128 (1996-08-01), Soref et al.
patent: 5572043 (1996-11-01), Shimizu et al.
patent: 5596527 (1997-01-01), Tomioka et al.
patent: 5607876 (1997-03-01), Biegelsen et al.
patent: 5617351 (1997-04-01), Bertin et al.
patent: 5630905 (1997-05-01), Lynch et al.
patent: 5659187 (1997-08-01), Legoues et al.
patent: 5683934 (1997-11-01), Candelaria
patent: 5698869 (1997-12-01), Yoshimi et al.
patent: 5705421 (1998-01-01), Matsushita et al.
patent: 5714777 (1998-02-01), Ismail et al.
patent: 5728623 (1998-03-01), Mori
patent: 5739567 (1998-04-01), Wong
patent: 5777347 (1998-07-01), Bartelink
patent: 5786612 (1998-07-01), Otani et al.
patent: 5786614 (1998-07-01), Chuang et al.
patent: 5792679 (1998-08-01), Nakato
patent: 5808344 (1998-09-01), Ismail et al.
patent: 5821577 (1998-10-01), Crabbe' et al.
patent: 5847419 (1998-12-01), Imai et al.
patent: 5855693 (1999-01-01), Murari et al.
patent: 5863830 (1999-01-01), Bruel et al.
patent: 5877070 (1999-03-01), Goesele et al.
patent: 5885987 (1999-03-01), Timmerman et al.
patent: 5891769 (1999-04-01), Liaw et al.
patent: 5906951 (1999-05-01), Chu et al.
patent: 5912479 (1999-06-01), Mori et al.
patent: 5923046 (1999-07-01), Tezuka et al.
patent: 5943560 (1999-08-01), Chang et al.
patent: 5951757 (1999-09-01), Dubbelday et al.
patent: 5963817 (1999-10-01), Chu et al.
patent: 5966622 (1999-10-01), Levine et al.
patent: 5993677 (1999-11-01), Biasse et al.
patent: 5998807 (1999-12-01), Lustig et al.
patent: 6013134 (2000-01-01), Chu et al.
patent: 6013553 (2000-01-01), Wallace et al.
patent: 6013563 (2000-01-01), Henley et al.
patent: 6020252 (2000-02-01), Aspar et al.
patent: 6033974 (2000-03-01), Henley et al.
patent: 6033995 (2000-03-01), Muller
patent: 6058044 (2000-05-01), Suglura et al.
patent: 6059895 (2000-05-01), Chu et al.
patent: 6074919 (2000-06-01), Gardner et al.
patent: 6096590 (2000-08-01), Chan et al.
patent: 6103559 (2000-08-01), Gardner et al.
patent: 6103597 (2000-08-01), Aspar et al.
patent: 6103599 (2000-08-01), Henley et al.
patent: 6107653 (2000-08-01), Fitzgerald
patent: 6111267 (2000-08-01), Fischer et al.
patent: 6117750 (2000-09-01), Bensahel et al.
patent: 6130453 (2000-10-01), Mei et al.
patent: 6133799 (2000-10-01), Favors et al.
patent: 6140687 (2000-10-01), Shimomura et al.
patent: 6143636 (2000-11-01), Forbes et al.
patent: 6153495 (2000-11-01), Kub et al.
patent: 6154475 (2000-11-01), Soref et al.
patent: 6160303 (2000-12-01), Fattaruso
patent: 6162688 (2000-12-01), Gardner et al.
patent: 6162705 (2000-12-01), Henley et al.
patent: 6166411 (2000-12-01), Buynoski
patent: 6184111 (2001-02-01), Henley et al.
patent: 6190998 (2001-02-01), Bruel et al.
patent: 6191007 (2001-02-01), Matsui et al.
patent: 6191432 (2001-02-01), Sugiyama et al.
patent: 6194722 (2001-02-01), Fiorini et al.
patent: 6204529 (2001-03-01), Lung et al.
patent: 6207977 (2001-03-01), Augusto
patent: 6210988 (2001-04-01), Howe et al.
patent: 6218677 (2001-04-01), Broekaert
patent: 6225192 (2001-05-01), Aspar et al.
patent: 6228694 (2001-05-01), Doyle et al.
patent: 6232138 (2001-05-01), Fitzgerald et al.
patent: 6235567 (2001-05-01), Huang
patent: 6235568 (2001-05-01), Murthy et al.
patent: 6242324 (2001-06-01), Kub et al.
patent: 6249022 (2001-06-01), Lin et al.
patent: 6251751 (2001-06-01), Chu et al.
patent: 6251755 (2001-06-01), Furukawa et al.
patent: 6261929 (2001-07-01), Gehrke et al.
patent: 6266278 (2001-07-01), Harari et al.
patent: 6271551 (2001-08-01), Schmitz et al.
patent: 6271726 (2001-08-01), Fransis et al.
patent: 6281532 (2001-08-01), Doyle et al.
patent: 6290804 (2001-09-01), Henley et al.
patent: 6291321 (2001-09-01), Fitzgerald
patent: 6303468 (2001-10-01), Aspar et al.
patent: 6313016 (2001-11-01), Kibbel et al.
patent: 6316301 (2001-11-01), Kant
patent: 6323108 (2001-11-01), Kub et al.
patent: 6326664 (2001-12-01), Chau et al.
patent: 6326667 (2001-12-01), Sugiyama et al.
patent: 6329063 (2001-12-01), Lo et al.
patent: 6335546 (2002-01-01), Tsuda et al.
patent: 6339232 (2002-01-01), Takagi
patent: 6344417 (2002-02-01), Usenko
patent: 6346459 (2002-02-01), Usenko et al.
patent: 6350311 (2002-02-01), Chin et al.
patent: 6350993 (2002-02-01), Chu et al.
patent: 6352909 (2002-03-01), Usenko
patent: 6355493 (2002-03-01), Usenko
patent: 6368733 (2002-04-01), Nishinaga
patent: 6368938 (2002-04-01), Usenko
patent: 6369438 (2002-04-01), Sugiyama et al.
patent: 6372356 (2002-04-01), Thornton et al.
patent: 6372593 (2002-04-01), Hattori et al.
patent: 6372609 (2002-04-01), Aga et al.
patent: 6387829 (2002-05-01), Usenko et al.
patent: 6391740 (2002-05-01), Cheung et al.
patent: 6399970 (2002-06-01), Kubo et al.
patent: 6403975 (2002-06-01), Brunner et al.
patent: 6407406 (2002-06-01), Tezuka
patent: 6410371 (2002-06-01), Yu et al.
patent: 6420937 (2002-07-01), Akatsuka et al.
patent: 6425951 (2002-07-01), Chu et al.
patent: 6429061 (2002-08-01), Rim
patent: 6445016 (2002-09-01), An et al.
patent: 6448152 (2002-09-01), Henley et al.
patent: 6455397 (2002-09-01), Belfor

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