Method of fabricating a semiconductor device using a CMP process

Details Method of fabricating a semiconductor device using a CMP process Method of fabricating a semiconductor device using a CMP process

1997-07-29

2000-07-11

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451 54, B24B 100

Patent

active

060864540

ABSTRACT:
A polishing apparatus includes a rotatable platen, a first driving device for causing the rotatable platen to rotate, a polishing head provided above the platen rotatably and holding a substrate in a manner such that the substrate faces the platen, a second driving device for causing the polishing head to rotate, an urging device for urging the substrate on the polishing head against the platen, a slurry feeding system for feeding a slurry to the platen, and a cleaning system for supplying a cleaning liquid containing an acid that dissolves a manganese oxide, to the polishing head. The cleaning system includes a nozzle provided in the polishing head for spraying the cleaning liquid to the platen.

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