Method of fabricating a semiconductor device including...

Details Method of fabricating a semiconductor device including... Method of fabricating a semiconductor device including...

2011-01-11

2011-01-11

Fahmy, Wael M (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S106000, C257S700000

Reexamination Certificate

active

07867828

ABSTRACT:
A semiconductor device includes a base plate, and a semiconductor constituent body formed on the base plate. The semiconductor constituent body has a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An insulating layer is formed on the base plate around the semiconductor constituent body. A hard sheet is formed on the insulating layer. An interconnection is connected to the external connecting electrodes of the semiconductor constituent body.

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