Method of fabricating a semiconductor device

Details Method of fabricating a semiconductor device Method of fabricating a semiconductor device

2007-09-04

2007-09-04

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S016000, C257S432000, C257SE29167

Reexamination Certificate

active

11109933

ABSTRACT:
A package substrate is placed in a first predetermined position on a supporting equipment. A chip guide equipment and a magnetic-field-generating equipment in a second predetermined position are placed near the package substrate. A semiconductor chip having a photoelectric element and a solenoid electrically connected to the photoelectric element in a surface region of the semiconductor chip is placed on the package substrate with the surface region facing away from the package substrate. The photoelectric element of the semiconductor chip is exposed to light so as to move the semiconductor chip toward the chip guide equipment by an interaction between a first magnetic field of the solenoid and a second magnetic field of the magnetic-field-generating equipment. A manufacturing step to the semiconductor chip is performed while keeping the position of the semiconductor chip near the chip guide equipment.

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patent: 6812061 (2004-11-01), Feierabend et al.
patent: 09-209970 (1997-08-01), None
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patent: 2001-179700 (2001-07-01), None
patent: 2003-188193 (2003-07-01), None

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