Method of fabricating a semiconductor device

Semiconductor device manufacturing: process – Repair or restoration

Reexamination Certificate

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Reexamination Certificate

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07955873

ABSTRACT:
A method of fabricating a semiconductor device is disclosed. In one embodiment, the method includes providing at least one semiconductor chip including an electrically conductive layer. A voltage is applied to an electrode. The electrode is moved over the electrically conductive layer for growing a metal layer onto the electrically conductive layer.

REFERENCES:
patent: 6132586 (2000-10-01), Adams et al.
patent: 2009/0045418 (2009-02-01), Yeh

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