Method of fabricating a semiconductor chip package

Details Method of fabricating a semiconductor chip package Method of fabricating a semiconductor chip package

2007-07-16

2008-08-12

Dang, Phuc T (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S123000, C257S678000

Reexamination Certificate

active

07410829

ABSTRACT:
A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

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patent: 2005/0253208 (2005-11-01), Otani
patent: 07-225240 (1995-08-01), None
patent: 11-135804 (1999-05-01), None

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