Method of fabricating a segmented monocrystalline chip

Details Method of fabricating a segmented monocrystalline chip Method of fabricating a segmented monocrystalline chip

1995-01-20

1997-07-08

Nguyen, Tuan H.

Fishing, trapping, and vermin destroying

437126, 437129, 437228, 216 72, 216 95, 156650, 156652, H01L 2120

Patent

active

056460643

ABSTRACT:
A portion of the surface of the first structure is protected by an oxide deposit, and the non-protective layers are etched down to a stop layer. The layers in the etched zone are then built up by molecular beam epitaxy, and one of the built-up layers is given a composition that is different from the composition of the corresponding adjacent layer in the first structure. The method is applicable to fabricating an integrated semiconductor comprising both a laser and a modulator.

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Patent Abstracts of Japan, vol. 14, No. 308 (E-947) 3 Jul. 1990 & JP-A-02 100 387 (The Furukawa Electric Co., Ltd) 12 Apr. 1990.

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