Method of fabricating a reworkable module

Details Method of fabricating a reworkable module Method of fabricating a reworkable module

1991-10-25

1994-01-04

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29841, 437209, H05K 334

Patent

active

052749134

ABSTRACT:
Disclosed is a reworkable circuit .package formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips to circuit cards and boards, and direct chip attachment ("DCA") where an encapsulant is disposed under the chip. The encapsulant offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. However, most encapsulants interfere with reworkability. The disclosed circuit package overcomes this problem by the provision of a passivating layer of Parylene is reworkable, dry processable, uniformly depositable by vapor phase deposition, forming thin films on facing surfaces at the 3-5 micron film thickness corresponding to the C4 lift-off distance.

REFERENCES:
patent: 4143456 (1979-03-01), Inoue
patent: 4323914 (1982-09-01), Berndlmaier
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5120678 (1992-06-01), Moore et al.
"Xylene Polymers", Encyclopedia of Polymer Science & Technology, vol. 17, Second Edition, pp. 990-1025.

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