Method of fabricating a resin mold type semiconductor device

Details Method of fabricating a resin mold type semiconductor device Method of fabricating a resin mold type semiconductor device

1982-12-15

1985-06-18

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29576S, 29589, 29590, 1563099, 156322, H01L 2152, H01L 2156

Patent

active

045233713

ABSTRACT:
A resin mold type semiconductor device comprising molded articles for sealing, each consisting of a resin material and having a gap portion thereinside; a semiconductor element positioned in said gap portion inside said molded article for sealing, said seminconductor element having electrodes; electrically conductive leads, each positioned in said gap portion of said molded article for sealing and having one end thereof protruding outwardly from said molded article for sealing; wires, each electrically connecting said electrode of said seminconductor element to said lead; and an insulation material covering at least the surface of said semiconductor element.

REFERENCES:
patent: 3610870 (1971-10-01), Sakamoto
patent: 3778685 (1973-12-01), Kennedy
patent: 3793474 (1974-02-01), Dunn et al.
patent: 3947953 (1976-05-01), Okada et al.
patent: 4305897 (1981-12-01), Hazama et al.

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