Method of fabricating a release substrate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S235000, C156S272200, C117S915000, C438S033000, C438S455000, C438S473000, C438S474000, C438S475000, C438S476000

Reexamination Certificate

active

07544265

ABSTRACT:
The invention relates to a method of fabricating a release substrate produced from semiconductor materials, the method comprising creating a reversible connection between two substrate release layers characterized in that the reversible connection is formed by a connecting layer produced using a first material as the basis, the connecting layer further comprising a nanoparticle concentrating zone of a second material disposed to facilitate release of the substrate, the first and second materials being selected to maintain the bonding energy of the reversible connection substantially constant even when the substrate is exposed to heat treatment.

REFERENCES:
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patent: 6331475 (2001-12-01), Yamazaki et al.
patent: 6339010 (2002-01-01), Sameshima
patent: 6352909 (2002-03-01), Usenko
patent: 6613678 (2003-09-01), Sakaguchi et al.
patent: 2001/0016399 (2001-08-01), Linn et al.
patent: 2002/0153563 (2002-10-01), Ogura
patent: 2003/0008475 (2003-01-01), Cheung et al.
patent: 2004/0222500 (2004-11-01), Aspar et al.
M. Zacharias et al., “Size-Controlled Highly Luminescent Silicon Nanocrystals: A SiO/SiO2Superlattice Approach”, Applied Physics Letters, vol. 80, No. 4, pp. 661-663 (2002).

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