Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-07-05
2009-06-09
Tucker, Philip C (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S235000, C156S272200, C117S915000, C438S033000, C438S455000, C438S473000, C438S474000, C438S475000, C438S476000
Reexamination Certificate
active
07544265
ABSTRACT:
The invention relates to a method of fabricating a release substrate produced from semiconductor materials, the method comprising creating a reversible connection between two substrate release layers characterized in that the reversible connection is formed by a connecting layer produced using a first material as the basis, the connecting layer further comprising a nanoparticle concentrating zone of a second material disposed to facilitate release of the substrate, the first and second materials being selected to maintain the bonding energy of the reversible connection substantially constant even when the substrate is exposed to heat treatment.
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M. Zacharias et al., “Size-Controlled Highly Luminescent Silicon Nanocrystals: A SiO/SiO2Superlattice Approach”, Applied Physics Letters, vol. 80, No. 4, pp. 661-663 (2002).
Akatsu Takeshi
Rayssac, legal representative Gisèle
Rayssac, legal representative Pierre
Mazumdar Sonya
S.O.I.Tec Silicon on Insulator Technologies
Tucker Philip C
Winston & Strawn LLP
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