Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to conductive state
Patent
1996-07-25
1999-01-05
Bowers, Jr., Charles L.
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to conductive state
438467, 438530, 438351, H01L 2170
Patent
active
058562133
ABSTRACT:
An antifuse structure is formed between two metal contacts in which a thin oxide layer is formed on the first or bottom metal, a shallow via is provided oxide layer and a layer of amorphous silicon is deposited over the thin oxide and into the shallow via without leaving the usual furrows in the amorphous silicon and thereby eliminating the step coverage problems of cusps forming in the subsequently applied second or top metal.
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patent: 5328868 (1994-07-01), Conti et al.
patent: 5633189 (1997-05-01), Yen et al.
Conducting Filament of the Programmed Metal Electrode Amorphous Silicon Antifuse, Kathryn E. Gordon and Richard J. Wong, pp. IEDM 93-27 thru -30-IEDM 93.
Developments in Non-Volatile FPGAs, Electronic Engineering, Apr. 1993, pp. 43, 45 and reference page.
Love Michela S.
Parks Delbert H.
Bowers Jr. Charles L.
Thompson Craig
VLSI Technology Inc.
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