Method of fabricating a probe card

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S842000, C029S847000, C439S083000

Reexamination Certificate

active

07975380

ABSTRACT:
Provided is a probe card and method of fabricating the same. This method comprises forming soldering bumpers electrically connected to conductive patterns on a substrate, forming probes connected to the conductive patterns and supported by the soldering bumpers, and then melting the soldering bumpers to fixing the probes to the substrate. Forming the soldering bumpers includes a step of forming the soldering bumpers in the same pattern and size by means of a photolithography process.

REFERENCES:
patent: 5508229 (1996-04-01), Baker
patent: 6790056 (2004-09-01), Buondelmonte et al.
patent: 7024763 (2006-04-01), Mathieu et al.
patent: 7293692 (2007-11-01), Akamatsu et al.
patent: 2002/0061668 (2002-05-01), Fujimura
patent: 07-167892 (1995-07-01), None
patent: 2002-158264 (2002-05-01), None
patent: 2002-164104 (2002-06-01), None
patent: 2003-282656 (2003-10-01), None
patent: 10-0323657 (2002-01-01), None
patent: 10-2002-0014677 (2002-02-01), None
patent: WO 02/15260 (2002-02-01), None
patent: WO0215260 (2002-02-01), None

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