Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2006-10-20
2008-08-19
Ahmed, Shamim (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S013000, C216S041000, C438S021000, C347S055000, C347S065000
Reexamination Certificate
active
07413671
ABSTRACT:
A method of fabricating a printhead integrated circuit includes the step of forming a first layer of a polymeric material on a substrate that incorporates drive circuitry. A heater element is formed on the first layer of polymeric material to be connected to the drive circuitry. A second layer of a polymeric material is formed on the heater element and the first layer such that the heater element is embedded in polymeric material. The polymeric layers are etched to define a plurality of radially extending bridging portions which terminate in a nozzle rim and a plurality of actuators which each extend between a respective pair of adjacent bridging portions and each terminate in a free end proximal to the rim. The substrate is etched so that the substrate and the actuators define a nozzle chamber in fluid communication with an ink ejection port defined by the nozzle rim.
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McAvoy Gregory John
Silverbrook Kia
Ahmed Shamim
Silverbrook Research Pty Ltd
LandOfFree
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