Method of fabricating a printed wiring board assembly

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29628, 174 685, 317101F, H05K 330

Patent

active

039711277

ABSTRACT:
A method of fabricating a folded printed wiring board assembly includes the steps of cutting an aperture into a rigid board; bonding a flexible circuit tape to one side of the board so that the tape bridges the aperture; perforating a plurality of holes through the board and flexible tape; inserting leads of electrical components through the holes; conductively bonding the leads to conductors on the flexible circuit tape; cutting two edges of the board through the aperture; and folding the assembly in the area of the aperture.

REFERENCES:
patent: 3499220 (1970-03-01), Hintz et al.
patent: 3501830 (1970-03-01), Bryzinski et al.
patent: 3718876 (1973-02-01), Fletcher
patent: 3766439 (1973-10-01), Isaacson
patent: 3818279 (1974-06-01), Seeger et al.
patent: 3819989 (1974-06-01), Braune
patent: 3873889 (1975-03-01), Leyba

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating a printed wiring board assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a printed wiring board assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a printed wiring board assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1618234

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.