Method of fabricating a printed circuitry substrate

Details Method of fabricating a printed circuitry substrate Method of fabricating a printed circuitry substrate

1986-05-01

1988-06-14

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 148 115A, 148 115N, 428469, H05K 330

Patent

active

047502622

ABSTRACT:
A composite substrate suitable for use as substrates for printed circuitry to which surface mountable components may be attached is disclosed. The substrate material comprises an alloy having a low coefficient of thermal expansion, to which aluminum is laminated and which is subsequently surface treated to produce a dielectric layer suitable to receive printed circuitry.

REFERENCES:
patent: 3423821 (1969-01-01), Nishimura
patent: 3469953 (1969-09-01), St. Clair et al.
patent: 3559285 (1971-02-01), Kauffman
patent: 4500605 (1985-02-01), Fister et al.
patent: 4542259 (1985-09-01), Butt
patent: 4649083 (1987-03-01), Fister et al.

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