Method of fabricating a printed circuit board with etched throug

Details Method of fabricating a printed circuit board with etched throug Method of fabricating a printed circuit board with etched throug

1977-06-27

1979-03-20

Esposito, Michael F.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427185, 427195, 427259, 427309, 156644, 156656, 156659, 156664, 29625, N05K 300, B05D 512, B05D 310, B05D 132

Patent

active

041454600

ABSTRACT:
A method of fabricating a printed circuit board is disclosed. The method comprises forming a patterned etch resist layer on a metal substrate and selectively etching the substrate to form a through hole with non-linear undercut walls. The etched metal substrate having the resist layer thereon is then coated with a dielectric powder to form a dielectric coat on the substrate having a sufficient through hole edge coverage.

REFERENCES:
patent: 3423261 (1969-01-01), Frantzen
patent: 3566461 (1968-07-01), Carbonel
patent: 3738879 (1973-06-01), VON Siemens
patent: 3934334 (1976-01-01), Hanni
"Etching Holes in Foil" J. R. DePew et al., IBM Tech. Disclosure Bul. vol. 19, No. 7, Dec. 1976.

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