Method of fabricating a printed circuit board power core using p

Details Method of fabricating a printed circuit board power core using p Method of fabricating a printed circuit board power core using p

1994-08-30

1996-04-09

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29851, 174258, 174259, 428901, H05K 310, H05K 103

Patent

active

055049931

ABSTRACT:
A method of fabricating a printed circuit board power core is disclosed wherein ceramic particles that have a diameter that is approximately equal to the desired dielectric thickness are combined with dielectric powders that have a relatively very small size. To produce a dielectric core using this technique, a dielectric material mixture is applied between two conductor layers and bonded therebetween. This dielectric material mixture preferably has a concentration of large particles equal to the desired core thickness with a loading factor of large/small particles less than the maximum ratio needed to provide the desired dielectric constant, but greater than the ratio required to provide stability during the pressing and curing steps.

REFERENCES:
patent: 4107837 (1978-08-01), Chang
patent: 4145460 (1979-03-01), Finley et al.
patent: 4403107 (1983-09-01), Hoffman
patent: 4490429 (1984-12-01), Tosaki et al.
patent: 4943516 (1990-07-01), Kamayachi et al.
patent: 5262595 (1993-11-01), Yano et al.

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