Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-04-01
2008-04-01
Phan, Tim (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S621000, C029S623400, C029S829000, C029S830000, C029S846000, C174S260000, C174S262000, C174S264000, C174S266000, C361S760000, C361S761000
Reexamination Certificate
active
07350296
ABSTRACT:
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.
REFERENCES:
patent: 6860000 (2005-03-01), Felten
patent: 7242591 (2007-07-01), Imamura et al.
patent: 2002-198638 (2002-07-01), None
patent: 2004-95851 (2004-03-01), None
patent: 2004-134424 (2004-04-01), None
Patent Abstracts of Japan for 2002-308158 filed on Oct. 23, 2002.
Patent Abstracts of Japan for 2000-266280 filed on Sep. 1, 2000.
Kang Myung Sam
Ryu Chang Sup
Darby & Darby P.C.
Phan Tim
Samsung Electro-Mechanics Co. Ltd.
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